ISI Indexed Journal Papers

[1] H. Vu-Dinh et al., “Immunomagnetic separation in a novel cavity-added serpentine microchannel structure for the selective isolation of lung adenocarcinoma cells,” Biomed Microdevices, vol. 23, no. 4, p. 51, Oct. 2021, doi: 10.1007/s10544-021-00589-6.

[2]      T. V. Quoc, V. N. Ngoc, B.-A. Hoang, C.-P. Jen, T. C. Duc, and T. T. Bui, “Development of a Compact Electrical Impedance Measurement Circuit for Protein Detection Two-electrode Impedance Micro-sensor,” IETE Journal of Research, vol. 0, no. 0, pp. 1–9, Mar. 2021, doi: 10.1080/03772063.2021.1893230.

[3]      V. T. Dau et al., “In-air particle generation by on-chip electrohydrodynamics,” Lab Chip, vol. 21, no. 9, pp. 1779–1787, May 2021, doi: 10.1039/D0LC01247E.

[4]      L. P. Xuan et al., “Development of a microfluidic flow-focusing droplet generating device utilising rapid prototyping technique,” International Journal of Nanotechnology, vol. 17, no. 7–10, pp. 708–721, Jan. 2020, doi: 10.1504/IJNT.2020.111335.

[5]      N. T. Van et al., “An electrohydrodynamic gyroscope,” Sensors and Actuators A: Physical, vol. 315, p. 112291, Nov. 2020, doi: 10.1016/j.sna.2020.112291.

[6]      L. L. Van et al., “Simulation and Experimental Study of a Synthetic Jet Valveless Pump,” IEEE/ASME Transactions on Mechatronics, vol. 25, no. 3, pp. 1162–1170, Jun. 2020, doi: 10.1109/TMECH.2019.2960332.

[7]      C.-D. Tran et al., “A new structure of Tesla coupled nozzle in synthetic jet micro-pump,” Sensors and Actuators A: Physical, vol. 315, p. 112296, Nov. 2020, doi: 10.1016/j.sna.2020.112296.

[8]      H. M. Nguyen and T. B. Thanh, “Electrostatic modulation of a photonic crystal resonant filter,” JNP, vol. 14, no. 2, p. 026014, May 2020, doi: 10.1117/1.JNP.14.026014.

[9]      H. N. Dac et al., “Study on Design Optimization of a Symmetry Two-Axis Tilt Angle Capacitive Sensor,” IETE Journal of Research, Sep. 2020, Accessed: Sep. 20, 2020. [Online]. Available: https://www.tandfonline.com/doi/abs/10.1080/03772063.2020.1816224

[10]    T. V. Quoc, V. N. Ngoc, T. T. Bui, C.-P. Jen, and T. C. Duc, “High-Frequency Interdigitated Array Electrode-Based Capacitive Biosensor for Protein Detection,” BioChip J, vol. 13, no. 4, pp. 403–415, Dec. 2019, doi: 10.1007/s13206-019-3412-3.

[11]    L. Do Quang, T. T. Bui, A. B. Hoang, T. P. Van, C.-P. Jen, and T. Chu Duc, “Development of a Passive Capacitively Coupled Contactless Conductivity Detection (PC4D) Sensor System for Fluidic Channel Analysis Toward Point-of-Care Applications,” IEEE Sensors Journal, vol. 19, no. 15, pp. 6371–6380, Aug. 2019, doi: 10.1109/JSEN.2019.2908179.

[12]    H. T. T. Thuy et al., “Study on Design Optimization of a Capacitive Tilt Angle Sensor,” IETE Journal of Research, vol. 0, no. 0, pp. 1–8, Aug. 2019, doi: 10.1080/03772063.2019.1649214.

[13]    C.-D. Tran, K. Le-Cao, T. T. Bui, and V. T. Dau, “Dielectrophoresis can control the density of CNT membranes as confirmed by experiment and dissipative particle simulation,” Carbon, vol. 155, pp. 279–286, Dec. 2019, doi: 10.1016/j.carbon.2019.08.076.

[14]    N. T. Van et al., “A Circulatory Ionic Wind for Inertial Sensing Application,” IEEE Electron Device Letters, vol. 40, no. 7, pp. 1182–1185, Jul. 2019, doi: 10.1109/LED.2019.2916478.

[15]    V. T. Dau, C. Tran, T. X. Dinh, L. B. Dang, T. Terebessy, and T. T. Bui, “Estimating the effect of asymmetric electrodes in bipolar discharge ion wind generator,” IEEE Transactions on Dielectrics and Electrical Insulation, vol. 25, no. 3, pp. 900–907, Jun. 2018, doi: 10.1109/TDEI.2018.006881.

[16]    Do Quang Loc, Tung Thanh Bui, Tran Thi Thu Ha, Kikuchi Katsuya, Aasahiro Aoyagi, and Chu Duc Trinh, “Fluidic Platform with Embedded Differential Capacitively Coupled Contactless Conductivity Detector for Micro-Object Sensing,” International Journal of Nanotechnology, vol. 15, no. 1/2/3, pp. 24–38, 2018, doi: https://doi.org/10.1504/IJNT.2018.089543.

[17]    Van Thanh Dau, Thien Xuan Dinh, Canh-Dung Tran, Tibor Terebessy, Trinh Chu Duc, and Tung Thanh Bui, “Particle precipitation by bipolar corona discharge ion winds,” Journal of Aerosol Science, vol. 124, pp. 83–94, Oct. 2018, doi: 10.1016/j.jaerosci.2018.07.007.

[18]    Loc Do Quang et al., “Circular electrodes stepping manipulation platform for A549 cancer cell detection,” International Journal of Nanotechnology, vol. 15, no. 11,12, pp. 983–997, 2018, doi: 10.1504/IJNT.2018.099936.

[19]    Loc Quang Do et al., “Dielectrophoresis Microfluidic Enrichment Platform with Built-In Capacitive Sensor for Rare Tumor Cell Detection,” BioChip J, vol. 12, no. 2, pp. 114–122, Jun. 2018, doi: 10.1007/s13206-017-2204-x.

[20]    Van Thanh Dau, Thien Xuan Dinh, Canh Dung Tran, Tung Thanh Bui, and Hoa Thanh Phan, “A study of angular rate sensing by corona discharge ion wind,” Sensors and Actuators A: Physical, vol. 277, pp. 169–180, Jul. 2018, doi: 10.1016/j.sna.2018.05.021.

[21]    Van Thanh Dau, Thien Xuan Dinh, Tung Thanh Bui, and Canh-Dung Tran, “Vortex flow generator utilizing synthetic jets by diaphragm vibration,” International Journal of Mechanical Sciences, vol. 142–143, pp. 432–439, Jul. 2018, doi: 10.1016/j.ijmecsci.2018.05.028.

[22]    Van Thanh Dau, Thien Xuan Dinh, Canh-Dung Tran, Tibor Terebessy, and Tung Thanh Bui, “Dual-pin electrohydrodynamic generator driven by alternating current,” Experimental Thermal and Fluid Science, vol. 97, pp. 290–295, Oct. 2018, doi: 10.1016/j.expthermflusci.2018.04.028.

[23]    Van Thanh Dau, Thien Xuan Dinh, Lam Bao Dang, Canh-Dung Tran, Tung Thanh Bui, and Phan Thanh Hoa, “Tri-axis convective accelerometer with closed-loop heat source,” Sensors and Actuators A: Physical, vol. 275, pp. 51–59, Jun. 2018, doi: 10.1016/j.sna.2018.03.047.

[24]    Tuan Vu Quoc, Meng-Syuan Wu, Tung Thanh Bui, Trinh Chu Duc, and Chun-Ping Jen, “A compact microfluidic chip with integrated impedance biosensor for protein preconcentration and detection,” Biomicrofluidics, vol. 11, no. 5, p. 054113, Sep. 2017, doi: 10.1063/1.4996118.

[25]    Thien Xuan Dinh, Dang Bao Lam, Canh-Dung Tran, Tung Thanh Bui, Phuc Hong Pham, and Van Thanh Dau, “Jet flow in a circulatory miniaturized system using ion wind,” Mechatronics, vol. 47, no. Supplement C, pp. 126–133, Nov. 2017, doi: 10.1016/j.mechatronics.2017.09.007.

[26]    Y. Y. Lim, Y. M. Goh, M. Yoshida, T. T. Bui, M. Aoyagi, and C. Liu, “30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 9, pp. 1506–1515, Sep. 2017, doi: 10.1109/TCPMT.2017.2718023.

[27]    Van Thanh Dau, Thien Xuan Dinh, Tung Thanh Bui, and Tibor Terebessy, “Corona anemometry using dual pin probe,” Sensors and Actuators A: Physical, vol. 257, pp. 185–193, Apr. 2017, doi: 10.1016/j.sna.2017.02.025.

[28]    Van Thanh Dau, Canh-Dung Tran, Tung Thanh Bui, V. D. X. Nguyen, and Thien Xuan Dinh, “Piezo-resistive and thermo-resistance effects of highly-aligned CNT based macrostructures,” RSC Adv., vol. 6, no. 108, pp. 106090–106095, Nov. 2016, doi: 10.1039/C6RA22872K.

[29]    Van Thanh Dau, Thien Xuan Dinh, Tibor Terebessy, and Tung Thanh Bui, “Ion Wind Generator Utilizing Bipolar Discharge in Parallel Pin Geometry,” IEEE Transactions on Plasma Science, vol. 44, no. 12, pp. 2979–2987, Dec. 2016, doi: 10.1109/TPS.2016.2580574.

[30]    Wei Feng, Tung Thanh Bui, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, and Katsuya Kikuchi, “Fabrication and stress analysis of annular-trench-isolated TSV,” Microelectronics Reliability, vol. 63, pp. 142–147, Aug. 2016, doi: 10.1016/j.microrel.2016.05.002.

[31]    Van Thanh Dau, Thien Xuan Dinh, Tung Thanh Bui, and Tibor Terebessy, “Bipolar corona assisted jet flow for fluidic application,” Flow Measurement and Instrumentation, vol. 50, pp. 252–260, Aug. 2016, doi: 10.1016/j.flowmeasinst.2016.07.005.

[32]    Van Thanh Dau, Thien Xuan Dinh, Tung Thanh Bui, Canh-Dung Tran, Hoa Thanh Phan, and Tibor Terebessy, “Corona based air-flow using parallel discharge electrodes,” Experimental Thermal and Fluid Science, vol. 79, pp. 52–56, Dec. 2016, doi: 10.1016/j.expthermflusci.2016.06.023.

[33]    Van Thanh Dau, Thien Xuan Dinh, Tibor Terebessy, and Tung Thanh Bui, “Bipolar corona discharge based air flow generation with low net charge,” Sensors and Actuators A: Physical, vol. 244, pp. 146–155, Jun. 2016, doi: 10.1016/j.sna.2016.03.028.

[34]    Tung Thanh Bui, Naoya Watanabe, Xiaojin Cheng, Fumiki Kato, Katsuya Kikuchi, and Masahiro Aoyagi, “Copper-Filled Through-Silicon Vias With Parylene-HT Liner,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 4, pp. 510–517, Apr. 2016, doi: 10.1109/TCPMT.2016.2521682.

[35]    Van Thanh Dau, Tung Thanh Bui, Thien Xuan Dinh, and Tibor Terebessy, “Pressure sensor based on bipolar discharge corona configuration,” Sensors and Actuators A: Physical, vol. 237, pp. 81–90, Jan. 2016, doi: 10.1016/j.sna.2015.11.024.

[36]    Van Thanh Dau, Thien Xuan Dinh, and Tung Thanh Bui, “Jet flow generation in a circulatory miniaturized system,” Sensors and Actuators B: Chemical, vol. 223, pp. 820–826, Feb. 2016, doi: 10.1016/j.snb.2015.09.151.

[37]    Bui Thanh Tung, Laina Ma, Takeru Amano, Katsuya Kikuchi, Masahiko Mori, and Masahiro Aoyagi, “A method enabling height-control of chips for edge-emitting laser stacking,” Jpn. J. Appl. Phys., vol. 54, no. 4S, p. 04DB02, Apr. 2015, doi: 10.7567/JJAP.54.04DB02.

[38]    Bui Thanh Tung, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, Naoya Watanabe, and Masahiro Aoyagi, “Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration,” Jpn. J. Appl. Phys., vol. 52, no. 4S, p. 04CB08, Apr. 2013, doi: 10.7567/JJAP.52.04CB08.

[39]    Bui Thanh Tung, Dzung Viet Dao, Taro Ikeda, Yoshiaki Kanamori, Kazuhiro Hane, and Susumu Sugiyama, “Investigation of strain sensing effect in modified single-defect photonic crystal nanocavity,” Opt. Express, vol. 19, no. 9, pp. 8821–8829, Apr. 2011, doi: 10.1364/OE.19.008821.

[40]    Bui Thanh Tung, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi, and Masahiro Aoyagi, “15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications,” Jpn. J. Appl. Phys., vol. 53, no. 4S, p. 04EB04, Mar. 2014, doi: 10.7567/JJAP.53.04EB04.

[41]    Van Thanh Dau et al., “A micromirror with CNTs hinge fabricated by the integration of CNTs film into a MEMS actuator,” J. Micromech. Microeng., vol. 23, no. 7, p. 075024, Jul. 2013, doi: 10.1088/0960-1317/23/7/075024.

[42]    Bui Thanh Tung, Hoang Minh Nguyen, Dzung Viet Dao, S. Rogge, H. W. M Salemink, and Susumu Susumu, “Strain Sensitive Effect in a Triangular Lattice Photonic Crystal Hole-Modified Nanocavity,” J. Sensor, vol. 11, no. 11, pp. 2657–2662, 2011, doi: 10.1109/JSEN.2011.2157122.

[43]    Van Thanh Dau, Takeo Yamada, Dzung Viet Dao, Bui Thanh Tung, Kenji Hata, and Susumu Sugiyama, “Integrated CNTs thin film for MEMS mechanical sensors,” Microelectronics Journal, vol. 41, no. 12, pp. 860–864, Dec. 2010, doi: 10.1016/j.mejo.2010.07.012.

[44]    Van Thanh Dau, Dzung Viet Dao, Takeo Yamada, Bui Thanh Tung, Kenji Hata, and Susumu Sugiyama, “Integration of SWNT film into MEMS for a micro-thermoelectric device,” Smart Mater. Struct., vol. 19, no. 7, p. 075003, Jun. 2010, doi: 10.1088/0964-1726/19/7/075003.

[45]    Bui Thanh Tung, Dzung Viet Dao, Toshiyuki Toriyama, and Susumu Sugiyama, “Measurement of mechanical and thermal properties of co-sputtered WSi thin film for MEMS applications,” Microsyst Technol, vol. 16, no. 11, pp. 1881–1886, Jun. 2010, doi: 10.1007/s00542-010-1109-6.

Scopus Indexed Journal Papers

[46]    Dzung Viet Dao et al., “Towards highly sensitive strain sensing based on nanostructured materials,” Adv. Nat. Sci: Nanosci. Nanotechnol., vol. 1, no. 4, p. 045012, Jan. 2011, doi: 10.1088/2043-6262/1/4/045012.

[47]    Bui Thanh Tung, Dzung Viet Dao, and Sugiyama Susumu, “Nanostrain Sensing Based on Piezo-optic Property of a Photonic Crystal Cavity,” IEEJ, vol. 131, no. 7, pp. 258–263, Jul. 2011, doi: http://dx.doi.org/10.1088/2043-6262/1/4/045012.

[48]    Dzung Viet Dao, Koichi Nakamura, Bui Thanh Tung, and Susumu Sugiyama, “Micro/nano-mechanical sensors and actuators based on SOI-MEMS technology,” Adv. Nat. Sci: Nanosci. Nanotechnol., vol. 1, no. 1, p. 013001, Mar. 2010, doi: 10.1088/2043-6254/1/1/013001.

[49]    Tran Duc Tan, Nguyen Thang Long, Nguyen Phu Thuy, Dao Viet Dung, and Bui Thanh Tung, “Full analysis and fabrication of a piezoresistive three degree of freedom accelerometor,” Advances in Natural Sciences, vol. 10, no. 2, pp. 187–192, Jun. 2009.

[50]    Bui Thanh Tung, Dao Viet Dung, Dau Thanh Van, and Sugiyama Susumu, “Three degree of freedom micro accelerometer depends on MEMS technology: Fabrication and application,” Advances in Natural Sciences, vol. 10, no. 2, pp. 229–236, Jun. 2009.

[51]    B. T. Tung, D. V. Dao, R. Amarasinghe, N. Wada, H. Tokunaga, and S. Sugiyama, “Development of a 3-DOF Micro Accelerometer with Wireless Readout,” IEEJ Transactions on Sensors and Micromachines, vol. 128, no. 5, pp. 235–239, 2008, doi: 10.1541/ieejsmas.128.235.

[52]    Bui Thanh Tung, Dzung Viet Dao, Amarasinghe Ranjith, Wada Naoki, Tokunaga Hiroshi, and Sugiyama Susumu, “Development of a 3-DOF Micro Accelerometer with Wireless Readout,” IEEJ Transactions on Sensors and Micromachines, vol. 128, no. 5, pp. 235–239, May 2008, doi: 10.1541/ieejsmas.128.235.

Domestic Journal Papers

[53]    Anh H. B. et al., “A Wireless Passive Conductivity Detector for Fluidic Conductivity Analyzation in Microchannel,” Journal of Science and Technology: Engineering and Technology for Sustainable Development, vol. 31, no. 2, pp. 89–94, Apr. 2021.

[54]    T. T. T. Ha, N. D. Hai, and B. T. Tung, “Symmetry Two-axis Tilt Angle Capacitive Sensor System,” VNU Journal of Science: Mathematics - Physics, vol. 35, no. 2, Jun. 2019, doi: 10.25073/2588-1124/vnumap.4334.

[55]    青柳昌宏 et al., “3 次元 IC 積層実装技術の実用化への取り組み,” Synthesiology, vol. 9, no. 1, pp. 1–14, Sep. 2016.

[56]    Masahiro Aoyagi, Thanh-Tung Bui, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, and Katsuya Kikuchi, “15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique : for Advanced Chip Stacking Applications,” Technical report of IEICE. SDM, vol. 113, no. 451, pp. 43–46, Feb. 2014.

[57]    Tung Thanh Bui, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, Naoya Watanabe, and Masahiro Aoyagi, “Erratum: ‘Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration,’” Japanese Journal of Applied Physics, vol. 52, p. 069202, 2013, doi: 10.1143/JJAP.52.069202.

[58]    Van Thanh Dau, Bui Thanh Tung, Dzung Viet Dao, and Susumu Sugiyama, “Integration of CNTs Thinfilm for Sensing and Actuating Micro Structures,” Vietnam Journal of Mechanics, vol. 34, no. 4, pp. 299–309, Nov. 2012, doi: 10.15625/0866-7136/34/4/2342.

[59]    Bui Thanh Tung, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, and Masahiro Aoyagi, “Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications,” Vietnam J. Mech., vol. 34, no. 4, pp. 289–297, Nov. 2012, doi: 10.15625/0866-7136/34/4/1760.

[60]    Dzung Viet Dao, Kyoji Shibuya, Tung Thanh Bui, and Susumu Sugiyama, “Micromachined NH3 Gas Sensor with ppb-level Sensitivity Based on WO3 Nanoparticles Thinfilm,” Procedia Engineering, vol. 25, pp. 1149–1152, Jan. 2011, doi: 10.1016/j.proeng.2011.12.283.

[61]    Bui Thanh Tung, Dzung Viet Dao, Taro Ikeda, Yoshiaki Kanamori, Kazuhiro Hane, and Susumu Sugiyama, “Longitudinal strain sensitive effect in a photonic crystal cavity,” Procedia Engineering, vol. 25, pp. 1357–1360, Jan. 2011, doi: 10.1016/j.proeng.2011.12.335.

[62]    V. N. Hung et al., “Design and Fabrication of a Miniaturized Three-Degree-of-Freedom Piezoresistive Acceleration Sensor Based on MEMS Technology Using Deep Reactive Ion Etching,” in Physics and Engineering of New Materials, vol. 127, D. T. Cat, A. Pucci, and K. Wandelt, Eds. Springer Berlin Heidelberg, 2009, pp. 377–383. Accessed: May 16, 2012. [Online]. Available: http://www.springerlink.com/content/n58431243t00x410/abstract/

[63]    Bao Anh Hoang et al., “A Wireless Passive Conductivity Detector for Fluidic Conductivity Analyzation in Microchannel,” JST: Engineering and Technology for Sustainable Development, vol. 1, no. 2, pp. 89–94, Apr. 2021, doi: 10.51316/jst.149.etsd.2021.1.2.15.

Conference papers 

International Conference

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[64]    L. P. Xuan, T. T. Bui, and T. C. Duc, “Development of a Thermal Cycler for Cell Culture Applications using Isothermal Amplification Technique,” in 2021 IEEE 5th International Conference on Information Technology, Information Systems and Electrical Engineering (ICITISEE), Nov. 2021, pp. 154–158. doi: 10.1109/ICITISEE53823.2021.9655858.

[65]    H. N. Thu et al., “Study on Thermal Convective Gas Gyroscope Based on Corona Discharge Ion Wind and Coriolis Effect,” in Advances in Engineering Research and Application, Cham, 2021, pp. 741–747. doi: 10.1007/978-3-030-64719-3_80.

[66]    H. T. Thanh, L. D. Quang, B.-A. Hoang, T. T. Bui, T. C. Duc, and C.-P. Jen, “A Serpentine Microchannel with Added Cavities Platform for Magnetic Separation of Lung Adenocarcinoma Cells Utilizing Aptamer-Conjugated Magnetic Bead Approach,” in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Jun. 2021, pp. 992–995. doi: 10.1109/Transducers50396.2021.9495390.

[67]    H.-A. Phan et al., “Development of a Vision System to Enhance the Reliability of the Pick-and-Place Robot for Autonomous Testing of Camera Module used in Smartphones,” in 2021 International Conference on Engineering and Emerging Technologies (ICEET), Oct. 2021, pp. 1–6. doi: 10.1109/ICEET53442.2021.9659578.

[68]    C. N. Nhu et al., “Characterization of Gelatin and PVA Nanofibers Fabricated Using Electrospinning Process,” in Advances in Engineering Research and Application, Cham, 2021, pp. 216–222. doi: 10.1007/978-3-030-64719-3_25.

[69]    T.-H. Nguyen et al., “Numerical Study and Experimental Investigation of an Electrohydrodynamic Device for Inertial Sensing,” in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Jun. 2021, pp. 1351–1354. doi: 10.1109/Transducers50396.2021.9495410.

[70]    H. T. Nguyen et al., “Neutralized Micro-Droplet Generated by On-Chip Electrohydrodynamic,” in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), Jan. 2021, pp. 563–566. doi: 10.1109/MEMS51782.2021.9375355.

[71]    Ngoc Tran Van et al., “Study on point-to-ring corona based gyroscope,” in Proceedings of the 32nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2019), United States, Jan. 2019, pp. 672–675. Accessed: Jun. 02, 2019. [Online]. Available: https://eprints.usq.edu.au/35658/

[72]    Cuong Nguyen Nhu, Hang Nguyen Thu, Luan Le Van, Trinh Chu Duc, Van Thanh Dau, and Tung Thanh Bui, “Study on Flow-Focusing Microfluidic Device with External Electric Field for Droplet Generation,” in Advances in Engineering Research and Application, 2019, pp. 553–559.

[73]    Chi Tran Nhu et al., “Experimental Characterization of an Ionically Conductive Fluid Based High Flexibility Strain Sensor,” in Advances in Engineering Research and Application, 2019, pp. 318–323.

[74]    Vu Quoc Tuan, Ngoc-Viet Nguyen, Meng-Syuan Wu, Chun-Ping Jen, Bui Thanh Tung, and Chu Duc Trinh, “Development of an Impedance Spectroscopy Measurement Circuit Board for Protein Detection,” in The International Conference on Communications and Electronics (ICCE-2018), Hue, Vietnam, Jul. 2018, pp. 184–188. doi: 10.1109/CCE.2018.8465758.

[75]    Tung Thanh Bui, Thien Xuan Dinh, Canh-Dung Tran, Trinh Chu Duc, and Van Thanh Dau, “A study of ion wind generator using parallel arranged electrode configuration for centrifugal flow mixer,” in Proceedings of the 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, Kaohsiung, Taiwan, Nov. 2018, vol. 4B1, pp. 305–308. Accessed: Jun. 02, 2019. [Online]. Available: https://1drv.ms/f/s!Aod0x1HRf5upia5LxxU1z6XsJYqCKA

[76]    Phong Bui Nhu, Thien Xuan Dinh, Hoa Thanh Phan, Canh-Dung Tran, Tung Thanh Bui, and Van Thanh Dau, “A Closed Device to Generate Vortex Flow Using PZT,” in 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Singapore, Apr. 2018, pp. 204–207. doi: 10.1109/NEMS.2018.8556981.

[77]    Loc Quang Do, Bao Anh Hoang, Thanh Pham Van, Kien Do Trung, Tung Thanh Bui, and Trinh Chu Duc, “Development of a LC Passive Wireless Sensor Utilizing Capacitively Coupled Contactless Detection Structure,” in The International Conference on Communications and Electronics (ICCE-2018), Hue, Vietnam, Jul. 2018, pp. 243–246.

[78]    Loc Do Quang, Tung Thanh Bui, Thanh Pham Van, Chun-Ping Jen, and Trinh Chu Duc, “Design and Implementation af A Passive C4D Sensor for Microfluidic Channel,” in Proceedings of the 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, Kaohsiung, Taiwan, Nov. 2018, vol. 4B1, pp. 682–685. Accessed: Jun. 02, 2019. [Online]. Available: https://1drv.ms/f/s!Aod0x1HRf5upia5LxxU1z6XsJYqCKA

[79]    Hoa Thanh Phan et al., “Study on Miniaturized Tri-Axis Heat Convection Accelerometer with Experimental Validation,” in 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Apr. 2018, pp. 644–647. doi: 10.1109/NEMS.2018.8556874.

[80]    Hoa Thanh Phan, Thien Xuan Dinh, Phong Bui Nhu, Canh-Dung Tran, Tung Thanh Bui, and Van Thanh Dau, “Robust Angular Rate Sensor Based on Corona Discharge Ion Wind,” in 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Apr. 2018, pp. 253–256. doi: 10.1109/NEMS.2018.8556865.

[81]    Ha Tran Thi Thuy, Hai Nguyen Dac, An Nguyen Ngoc, Dung Nguyen Ngoc, Thai Le Van, and Tung Thanh Bui, “A 3D Printed Two-axis Tilt Angle Capacitive Sensor,” in 2018 IEEE Seventh International Conference on Communications and Electronics (ICCE), Hue, Vietnam, Jul. 2018, pp. 191–195. doi: 10.1109/CCE.2018.8465753.

[82]    Cuong Nguyen Nhu et al., “Performance Evaluation of A Pzt Actuated Valveless Mixer,” in Proceedings of the 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, Kaohsiung, Taiwan, Nov. 2018, vol. 4B1, pp. 682–685. Accessed: Jun. 02, 2019. [Online]. Available: https://1drv.ms/f/s!Aod0x1HRf5upia5LxxU1z6XsJYqCKA

[83]    Tung Thanh Bui, Thien Xuan Dinh, Canh-Dung Tran, Trinh Chu Duc, and Van Thanh Dau, “Computational and experimental study on ion wind scheme based aerosol sampling for biomedical applications,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 560–563. doi: 10.1109/TRANSDUCERS.2017.7994110.

[84]    Tuan Vu Quoc, Meng-Syuan Wu, Tung Thanh Bui, Trinh Chu Duc, and Chun-Ping Jen, “A compact exclusion-enrichment microfluidic chip with integrated impedance biosensor for lowconcentration protein detection,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 638–641. doi: 10.1109/TRANSDUCERS.2017.7994130.

[85]    Ngoc Tran Van, Tung Thanh Bui, Thien Xuan Dinh, Tibor Terebessy, Trinh Chu Duc, and Van Thanh Dau, “A symmetrically arranged electrodes for corona discharge anemometry,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 1112–1115. doi: 10.1109/TRANSDUCERS.2017.7994247.

[86]    Luan Le Van, Cuong Nguyen Nhu, An Nguyen Ngoc, Tung Thanh Bui, Van Thanh Dau, and Trinh Chu Duc, “A Valveless Micropump based on Additive Fabrication Technology,” in Proceedings of The 6th International Workshop on Nanotechnology And Application - IWNA 2017, Phan Thiet, Vietnam, Oct. 2017, pp. 627–630.

[87]    Loc Do Quang et al., “Dielectrophoresis enrichment with built-in capacitive sensor microfluidic platform for tumor rare cell detection,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 484–487. doi: 10.1109/TRANSDUCERS.2017.7994091.

[88]    Loc Do Quang et al., “Circular Electrodes Stepping Manipulation Platform for A549 Cancer Cell Detection,” in Proceedings of The 6th International Workshop on Nanotechnology And Application - IWNA 2017, Phan Thiet, Vietnam, Oct. 2017, pp. 649–652.

[89]    Lam Bao Dang, Thien Xuan Dinh, Tung Thanh Bui, Trinh Chu Duc, Hoa Thanh Phan, and Van Thanh Dau, “Ionic JET flow in a circulatory miniaturized system,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 2099–2102. doi: 10.1109/TRANSDUCERS.2017.7994488.

[90]    Ha Tran Thi Thuy et al., “Coplanar differential capacitively coupled contactless conductivity detection (CD-C4D) sensor for micro object inside fluidic flow recognization,” in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Jun. 2017, pp. 1124–1127. doi: 10.1109/TRANSDUCERS.2017.7994250.

[91]    A. S. Sherpa et al., “Novel apparatus for simultaneous monitoring of electrocardiogram in awake zebrafish,” in 2017 IEEE SENSORS, Oct. 2017, pp. 1434–1436. doi: 10.1109/ICSENS.2017.8234354.

[92]    Wei Feng, Tung Thanh Bui, Naoya Watanabe, Masahiro Aoyagi, and Katsuya Kikuchi, “Low Residual Stress in Si Substrate of Annular-Trench-Isolated TSV,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 2016, pp. 1611–1616. doi: 10.1109/ECTC.2016.124.

[93]    Tung Thanh Bui, Xioujin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, and Masahiro Aoyagi, “A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 2016, pp. 2182–2187. doi: 10.1109/ECTC.2016.344.

[94]    Tung Thanh Bui, Thien Xuan Dinh, Tibor Terebessy, Trinh Chu Duc, and Van Thanh Dau, “Jet flow focusing by corona discharge for fluidic application,” in 2016 IEEE SENSORS, Orlando, FL, USA, Oct. 2016, pp. 826–828. doi: 10.1109/ICSENS.2016.7808681.

[95]    Tiep Dang Dinh et al., “Two-axis tilt angle detection based on dielectric liquid capacitive sensor,” in 2016 IEEE Sensors, Orlando, FL, USA, Oct. 2016, pp. 907–909. doi: 10.1109/ICSENS.2016.7808708.

[96]    Tiep Dang Dinh et al., “Tilt sensor based on three electrodes dielectric liquid capacitive sensor,” in 2016 IEEE Sixth International Conference on Communications and Electronics (ICCE), Ha Long, Vietnam, Jul. 2016, pp. 172–175. doi: 10.1109/CCE.2016.7562631.

[97]    Hannah Robbins, Changqing Liu, Sijung Hu, Tung Thanh Bui, and M. Aoyagi, “Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH),” in 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, France, Sep. 2016, pp. 1–6. doi: 10.1109/ESTC.2016.7764496.

[98]    Ha Tran Thi Thuy, Viet Nguyen Ngoc, Cuong Nguyen Nhu, Tung Thanh Bui, and Trinh Chu Duc, “Biological microparticles detection based on differential capacitive sensing and dielectrophoresis manipulation,” in 2016 International Conference on Advanced Technologies for Communications (ATC), Hanoi, Viet Nam, Oct. 2016, pp. 297–301. doi: 10.1109/ATC.2016.7764793.

[99]    Dau Thanh Van, Bui Thanh Tung, Thien Xuan Dinh, Tibor Terebessy, and Phan Thanh Hoa, “Absolute pressure sensing with bipolar corona discharge: Design, simulation and experimental validation,” in 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), Shanghai, China, Jan. 2016, pp. 820–823. doi: 10.1109/MEMSYS.2016.7421755.

[100]  Quang Loc Do, Bui Thanh Tung, T. T. H. Tran, Katsuya Kikuchi, Masahiro Aoyagi, and Trinh Chu Duc, “Differential capacitively coupled contactless conductivity detection (DC4D) sensor for detection of object in microfluidic channel,” in 2015 IEEE SENSORS, Busan, Korea, Nov. 2015, pp. 1–4. doi: 10.1109/ICSENS.2015.7370574.

[101]  Loc Do Quang, Tung Thanh Bui, Ha Tran Thi Thuy, Katsuya Kikuchi, Masahiro Aoyagi, and Trinh Chu Duc, “Micro fluidic platform for living cell detection,” in The 5th International Workshop on Nanotechnology and Applications (IWNA 2015), Vung Tau, Viet Nam, 2015, pp. 223–226.

[102]  Bui Thanh Tung, Thien Xuan Dinh, Phan Thanh Hoa, and Van Thanh Dau, “Study on the PZT diaphragm actuated multiple jet flow in a circulatory miniaturized system,” in 2015 IEEE Sensors, Busan, Korea, Nov. 2015, pp. 1–4. doi: 10.1109/ICSENS.2015.7370443.

[103]  Bui Thanh Tung, Naoya Watanabe, Masahiro Aoyagi, and Kikuchi Katsuya, “Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner,” in 3D Systems Integration Conference (3DIC), 2015 International, Sendai, Japan, Aug. 2015, p. TS8.6.1-TS8.6.4. doi: 10.1109/3DIC.2015.7334611.

[104]  Ying Ying Lim et al., “Silver screen printed transmission lines- analyzing the influence of substrate roughness on the RF performance up to 30 GHz,” in Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, Singapore, Dec. 2014, pp. 22–26. doi: 10.1109/EPTC.2014.7028386.

[105]  Tuan Vu Quoc, Thinh Pham Quoc, Trinh Chu Duc, Bui Thanh Tung, Katsuya Kikuchi, and Masahiro Aoyagi, “Capacitive sensor based on PCB technology for air bubble inside fluidic flow detection,” in 2014 IEEE SENSORS, Valencia, Spain, Nov. 2014, pp. 237–240. doi: 10.1109/ICSENS.2014.6984977.

[106]  Samson Melamed, Fumiki Kato, Bui Thanh Tung, Shunsuke Nemoto, and Masahiro Aoyagi, “Method for Fabricating Microchannels with  Photopatternable Adhesives for 3D Integrated Circuits,” in Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, Tsukuba, Japan, Aug. 2014, p. 28.

[107]  Masahiro Aoyagi, Bui Thanh Tung, Ma Laina, Takeru Amano, Kikuchi Katsuya, and Mori Masahiko, “A method enables height-control of bonding chip for edge-emitting laser stacking,” in The 2014 International Conference on Solid State Devices and Materials, Tsukuba, Japan, 2014, pp. 510–511.

[108]  Bui Thanh Tung, Xiaojin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, and Masahiro Aoyagi, “Fabrication and electrical characterization of Parylene-HT liner bottom-up copper filled through silicon via (TSV),” in 2014 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, Nov. 2014, pp. 154–157. doi: 10.1109/ICSJ.2014.7009633.

[109]  Bui Thanh Tung, Xiaojin Cheng, N. Watanabe, F. Kato, K. Kikuchi, and M. Aoyagi, “Investigation of low-temperature deposition high-uniformity coverage Parylene-HT as a dielectric layer for 3D interconnection,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, Orlando, USA, May 2014, pp. 1926–1931. doi: 10.1109/ECTC.2014.6897565.

[110]  Bui Thanh Tung, Xiaojin Cheng, N. Watanabe, F. Kato, K. Kikuchi, and M. Aoyagi, “Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration,” in 3D Systems Integration Conference (3DIC), 2014 International, Cork, Ireland, Dec. 2014, p. 4 pp. doi: 10.1109/3DIC.2014.7152162.

[111]  Bui Thanh Tung, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, and Masahiro Aoyagi, “Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, Orlando, USA, May 2014, pp. 62–67. doi: 10.1109/ECTC.2014.6897268.

[112]  Bui Thanh Tung, Laina Ma, Takeru Amano, K. Kikuchi, and Masahiro Aoyagi, “High-precision integration approach based on alignment maintaining flip-chip bonding using cone shaped bump and truncated pyramid pad,” in 2014 International Conference on Optical MEMS and Nanophotonics (OMN), Glasgow, Scotland, Aug. 2014, pp. 105–106. doi: 10.1109/OMN.2014.6924558.

[113]  Toshihiro Kamei, Noriyuki Tsujimura, Keiko Sumitomo, Ma Laina, Bui Thanh Tung, and Aoyagi Masahiro, “Towards a fully Integrated Fluorescence Detector  for Point-of-Care Microfluidic Biochemical Analysis,” in International Symposium on Frontiers of Materials Science (ISFMS), Hanoi, Vietnam, Nov. 2013, p. 107.

[114]  Samson Melamed et al., “Investigation of a microchannel-based cooling interposer for high-performance memory-on-logic 3DIC design,” in Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, Singapore, Dec. 2013, pp. 358–362. doi: 10.1109/EPTC.2013.6745742.

[115]  Bui Thanh Tung et al., “High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects,” presented at the International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, Zweibrücken, Germany, Jul. 2013. Accessed: Jul. 29, 2013. [Online]. Available: http://www.fh-kl.de/

[116]  Bui Thanh Tung et al., “Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications,” in Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, Lasvegas, USA, May 2013, pp. 425–430. doi: 10.1109/ECTC.2013.6575606.

[117]  Bui Thanh Tung, Naoya Watanabe, Xiaojin Cheng, Kato Fumiki, Kikuchi Katsuya, and Aoyagi Masahiro, “Study of Copper Diffusion into Parylene-HT Dielectric Thinfilm using Dynamic Secondary Ion  Mass Spectrometry (D-SIMS),” presented at the International Symposium on Materials Science and Surface Technology 2013 (MSST2013), Yokohama, Japan, Nov. 2013.

[118]  Bui Thanh Tung, Naoya Watanabe, Xiaojin Cheng, Fumiki Kato, Katsuya Kikuchi, and Masahiro Aoyagi, “Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system,” in International Symposium on Frontiers of Materials Science (ISFMS), Hanoi, Viet Nam, Nov. 2013, pp. 169–170.

[119]  Bui Thanh Tung, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi, and Masahiro Aoyagi, “15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications,” in Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials, Fukuoka, Japan, Sep. 2013, pp. 986–987. Accessed: Oct. 11, 2013. [Online]. Available: http://www.ssdm.jp/advanceprogram.html

[120]  Dzung Viet Dao, Bui Thanh Tung, and Susumu Sugiyama, “Photonic Crystal Nanostructures for Nanomechanical Sensing Applications,” in International Conference on BioElectronics, BioSensors, BioMedical Devices, BioMEMS/NEMS and Applications 2012 (Bio4Apps 2012), National University of Singapore, Singapore, Nov. 2012, p. 57.

[121]  Bui Thanh Tung, Suzuki Motohiro, Kato Fumiki, Watanabe Naoya, Nemoto Shunsuke, and Aoyagi Masahiro, “A Prospective Sub-micron Range Integration Approach for Photonics-Electronics Heterogeneous Convergence Applications,” in 2nd International Symposium on Photonics and Electronics Convergence (ISPEC2012), Tokyo, Japan, Dec. 2012, p. 53.

[122]  Bui Thanh Tung, Ma Laina, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, and Masahiro Aoyagi, “High-precision heterogeneous integration based on flip-chip bonding using misalignment self-correction elements,” in 2012 International Conference on Optical MEMS and Nanophotonics (OMN), Banff, Canada, Aug. 2012, pp. 93–94. doi: 10.1109/OMEMS.2012.6318818.

[123]  Bui Thanh Tung et al., “Sub-micron-accuracy Gold to Gold Interconnection Flip-Chip Bonding Approach for Electronics-Optics Heterogeneous Integration,” in Int. Conf. Solid State Devices and Materials, Kyoto, Japan, Sep. 2012, pp. 1174–1175. Accessed: Sep. 14, 2012. [Online]. Available: http://www.ssdm.jp/advanceprogram.html

[124]  Dzung Viet Dao, Bui Thanh Tung, and Susumu Sugiyama, “Displacement Sensing Based on Two-dimensional Photonic Crystal Nano-rod Defect Cavity,” presented at the 28th Sensor Symposium, Tokyo, Japan, 2011.

[125]  Dzung Viet Dao, Bui Thanh Tung, and Sugiyama Susumu, “Strain Sensing Effect in Silicon Photonic Crystal Nanocavities,” in Proceedings of the 3rd Int’l Workshop on Nanotechnology and Application, Vung Tau, Viet Nam, Nov. 2011, pp. 161–171.

[126]  Bui Thanh Tung, Van Thanh Dau, Dzung Viet Dao, Takeo Yamada, Kenji Hata, and Susumu Sugiyama, “Fabrication and characterization of silicon micro mirror with CNT hinge,” in The 24th International Conference on Micro Electro Mechanical Systems, Cancun, Mexico, Jan. 2011, pp. 688–691. doi: 10.1109/MEMSYS.2011.5734518.

[127]  Tan Duc Tran, Tuyen Ta Duc, and Bui Thanh Tung, “Combination compress sensing and digital wireless transmission for the MRI signal,” in Micro-NanoMechatronics and Human Science (MHS), 2010 International Symposium on, Nagoya, Japan, 2010, pp. 273–276. doi: 10.1109/MHS.2010.5669546.

[128]  Dzung Viet Dao, Bui Thanh Tung, and Susumu Sugiyama, “Theoretical investigation of piezo-optic effect in photonic crystal nanocavity for nanostrain detection,” in Micro-NanoMechatronics and Human Science (MHS), 2010 International Symposium on, Nagoya, Japan, 2010, pp. 443–446. doi: 10.1109/MHS.2010.5669506.

[129]  Dau Thanh Van, Yamada Tako, Dao Viet Dung, Bui Thanh Tung, Hata Kenji, and Sugiyama Susumu, “MEMS process of CNTs thin film and its application,” in The 5th Asis-pacific conference on Transducers and micro-nano technology (APCOT 2010), Perth, Australia, Jun. 2010, pp. 223–223.

[130]  Bui Thanh Tung, Hoang Minh Nguyen, Dzung Viet Dao, Sven Rogge, Huub Salemink, and Sugiyama Susumu, “Strain Sensitivity of a Modified Single-Defect Photonic Crystal Nanocavity for Mechanical Sensing,” in IEEE Sensors, 2010, Hawaii, USA, 2010, pp. 2585–2588. Accessed: Jan. 15, 2011. [Online]. Available: http://research-db.ritsumei.ac.jp/Profiles/37/0003645/meeting_achieve1.html

[131]  Bui Thanh Tung, Dzung Viet Dao, and Susumu Sugiyama, “Investigation of strain sensitivity of photonic crystal nanocavity for mechanical sensing,” in Optical MEMS and Nanophotonics (OPT MEMS), 2010 International Conference on, Sapporo, Japan, Aug. 2010, pp. 183–184. doi: 10.1109/OMEMS.2010.5672122.

[132]  Van Thanh Dau, Takeo Yamada, Dzung Viet Dao, Bui Thanh Tung, Kenji Hata, and Susumu Sugiyama, “Piezoresistive and thermoelectric effects of CNT thin film patterned by EB lithography,” in Sensors, 2009 IEEE, Christchurch New Zealand, 2009, pp. 1048–1051. doi: 10.1109/ICSENS.2009.5398590.

[133]  Tran Duc Tan, Bui Thanh Tung, and Nguyen Phu Thuy, “A novel optimization procedure for designing of high-sensitivity piezoresistive accelerometers utilizing MNA method,” in Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on, Nagoya, Japan, 2009, pp. 44–47. doi: 10.1109/MHS.2009.5352097.

[134]  Koichi Nakamura, Dzung Viet Dao, Bui Thanh Tung, Toshiyuki Toriyama, and Susumu Sugiyama, “Piezoresistive effect in silicon nanowires — A comprehensive analysis based on first-principles calculations,” in Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on, Nagoya, Japan, 2009, pp. 38–43. doi: 10.1109/MHS.2009.5352099.

[135]  Bui Thanh Tung, Dzung Viet Dao, Toshiyuki Toriyama, and Susumu Sugiyama, “Evaluation of the piezoresistive effect in single crystalline silicon nanowires,” in Sensors, 2009 IEEE, Christchurch New Zealand, 2009, pp. 41–44. doi: 10.1109/ICSENS.2009.5398124.

[136]  Bui Thanh Tung, Dzung Viet Dao, Koichi Nakamura, Toshiyuki Toriyama, and Susumu Sugiyama, “Characterization of the piezoresistive effect and temperature coefficient of resistance in single crystalline silicon nanowires,” in Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on, Nagoya, Japan, 2009, pp. 462–466. doi: 10.1109/MHS.2009.5351972.

[137]  Amarasinghe Ranjith, Dzung Viet Dao, Van Thanh Dau, Bui Thanh Tung, and Susumu Sugiyama, “Sensitivity enhancement of piezoresistive micro acceleration sensors with Nanometer Stress Concentration Regions on sensing elements,” in Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International, Colorado, USA, Jun. 2009, pp. 1333–1336. doi: 10.1109/SENSOR.2009.5285847.

[138]  Tran Duc Tan, Dzung Viet Dao, Bui Thanh Tung, Nguyen Thang Long, Nguyen Phu Thuy, and Susumu Sugiyama, “Optimum design considerations for a 3-DOF micro accelerometer using nanoscale piezoresistors,” in Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on, Sanya, China, 2008, pp. 770–773. doi: 10.1109/NEMS.2008.4484440.

[139]  Thanh Van Dau, Thien Xuan Dinh, Dzung Viet Dao, Amarasinghe Ranjith, Bui Thanh Tung, and Susumu Sugiyama, “Design and Simulation of Convective Inertial Sensor,” in Micro-NanoMechatronics and Human Science, 2008. MHS 2008. International Symposium on, Nagoya, Japan, Nov. 2008, pp. 33–36. doi: 10.1109/MHS.2008.4752418.

[140]  Phuc Hong Pham, Dzung Viet Dao, Bui Thanh Tung, and Susumu Sugiyama, “A Micro Rotational Motor Based on Ratchet Mechanism and Electrostatic Comb-Drive Actuators,” in The 4th Asia Pacific Conference on Transducers andMicro-Nano Technology (APCOT’8), Taiwan, Jun. 2008, pp. 55–58.

[141]  Tran Duc Tan, Dao Viet Dung, Bui Thanh Tung, Nguyen Thang Long, and Nguyen Phu Thuy, “Full analysis and fabrication of a piezoreisstive three degree of freedom accelerometer,” Vung Tau, Vietnam, 2007, pp. 264–267. Accessed: Jan. 15, 2011. [Online]. Available: http://wiki.answers.com/Q/What_is_the_abbreviation_for_domestic

[142]  Bui Thanh Tung, Dzung Viet Dao, Dau Thanh Van, and Sugiyama Susumu, “Three degree of freedom micro accelerometer depend on MEMS technology: Fabrication and application,” Vung Tau, Vietnam, 2007, pp. 89–92. Accessed: Jan. 15, 2011. [Online]. Available: http://wiki.answers.com/Q/What_is_the_abbreviation_for_domestic

[143]  Chu Duc Trinh, Nguyen Thang Long, Bui Thanh Tung, and Nguyen Phu Thuy, “Patient monitoring system based on MEMS sensors and wireless network,” presented at the International Conference on Mechatronics Technology (ICMT2005), Malaysia, 2005. Accessed: Jan. 15, 2011. [Online]. Available: http://wiki.answers.com/Q/What_is_the_abbreviation_for_domestic

[144]  Chu Duc Trinh, Nguyen Phu Thuy, Vu Ngoc Hung, Dinh Van Dung, and Bui Thanh Tung, “Application of MEMS pressure sensors in the medical electronic device,” Ha Long, Vietnam, Apr. 2004, pp. 230–234.

[145]  H. T. Nguyen et al., “Neutralized Micro-Droplet Generated by On-Chip Electrohydrodynamic,” in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), Jan. 2021, pp. 563–566. doi: 10.1109/MEMS51782.2021.9375355.

[146]  C. N. Nhu et al., “Characterization of Gelatin and PVA Nanofibers Fabricated Using Electrospinning Process,” in Advances in Engineering Research and Application, Cham, 2021, pp. 216–222. doi: 10.1007/978-3-030-64719-3_25.

[147]  H. N. Thu et al., “Study on Thermal Convective Gas Gyroscope Based on Corona Discharge Ion Wind and Coriolis Effect,” in Advances in Engineering Research and Application, Cham, 2021, pp. 741–747. doi: 10.1007/978-3-030-64719-3_80.

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